The thermal pad is silicone based with modelling clay like consistency. This allows a perfect surface shaping with maximum possible compression. The minus pad extreme is electrically insulating.
Due to the consistency only one-time use is recommended. The thermal conductivity was improved by about 260 % over the minus pad 8 which allows best cooling for tough cooling operations such as voltage regulators and memory ICs.
Most excellent thermal conductivity
No bleeding
long-term stability
high compression rate
Application and Ratings:
Thermal Conductivity*
*****
Sub-Zero Overclocking
*
Overclocking
****
Water Cooling
*****
Air Cooling
*****
*within the Capabilities of Thermal Pads
The minus pad extremes are available in the sizes of 120x20mm, 100x100mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm.